| Formula |
CAS |
| C15H16O2 |
80-05-7 |
Background
Bisphenol A is the raw material used in the production of acrylic and epoxy resin. Acrylates based on bisphenol A or epoxy resin can be polymerirzed not only by exposure to UV light, electron beams or visible light, but also chemically activated by the use of various peroxides. Bisphenol A is also used as a fungicide.
SynonymsBisphenol A
2,2-bis(4-hydroxyphenyl)propane
4,4´-Isopropylidene diphenol
4,4´-(1-Methylethyldene)bisphenol
UsesAcrylic and epoxy resin
Semi-synthetic wax
Cross-ReactionsDiethylstilbestrol
Hydroquinone monobenzyl ether
Unusual Reactions
Back to list of contact allergens
Referenties
| 1. |
Fregert S, Persson K, Trulsson L. Hidden sources of unhardened epoxy resin of bisphenol A type. Contact Dermatitis 1980;6(6):446-447. |
| 2. |
Freeman K, Warin AP. Contact dermatitis due to bisphenol A in semi-synthetic
waxes. Contact Dermatitis 1984;11(4):259-260. |
| 3. |
Jolanki R, Kanerva L, Estlander T, Tarvainen K, Keskinen H, Henriks-Eckerman ML. Occupational dermatoses from epoxy resin compounds. Contact Dermatitis 1990;23(3):172-183. |
| 4. |
Holness DL, Nethercott JR. The performance of specialized collections of bisphenol A epoxy resin system components in the evaluation of workers in an occupational health clinic population. Contact Dermatitis 1993;28(4):216-219. |
Author(s):Allergology: background information on allergens.
ICD10: L23.9